The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Aug. 22, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Chiara Cerafogli, Boise, ID (US);

Kenneth William Marr, Boise, ID (US);

Brian J. Soderling, Eagle, ID (US);

Michael P. Violette, Boise, ID (US);

Joshua Daniel Tomayer, Meridian, ID (US);

James Eric Davis, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 41/40 (2023.01); G11C 16/04 (2006.01); G11C 16/08 (2006.01); G11C 16/26 (2006.01); G11C 29/14 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H03K 3/03 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G11C 16/0483 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01); G11C 29/14 (2013.01); H01L 22/20 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H03K 3/0315 (2013.01); H10B 41/27 (2023.02); H10B 41/40 (2023.02); H10B 43/27 (2023.02); H10B 43/40 (2023.02); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49176 (2013.01);
Abstract

Some embodiments include apparatuses and methods of fabricating the apparatuses. One of the apparatuses includes a substrate of a semiconductor die; a memory cell portion located over a first portion of the substrate; a conductive pad portion located over a second portion of the substrate and outside the memory cell portion; and a sensor circuit including a portion located over the second portion of the substrate and under the conductive pad portion. The conductive pad portion includes conductive pads. Each of the conductive pads is part of a respective electrical path coupled to a conductive contact of a base outside the substrate.


Find Patent Forward Citations

Loading…