The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Apr. 12, 2022
Micron Technology, Inc., Boise, ID (US);
Kunal R. Parekh, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor device assembly includes a first semiconductor device having front and rear surfaces, a plurality of front-side pads disposed over the front surface at a first distance from the rear surface, and a plurality of additional device pads disposed over the front surface at a second distance from the rear surface greater than the first distance; a second semiconductor device in contact with a top side of each of the additional device pads; an encapsulant material at least partially surrounding the second semiconductor device and covering a top side of the front-side pads; a first plurality of TSVs, each extending from the rear surface through the first semiconductor device to a bottom side of one of the front-side pads; and a second plurality of TSVs, each extending from the rear surface through the first semiconductor device to a bottom side of corresponding one of the additional device pads.