The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Apr. 27, 2020
Applicant:

Tokyo Institute of Technology, Tokyo, JP;

Inventors:

Hiroshi Funakubo, Tokyo, JP;

Takao Shimizu, Tokyo, JP;

Takanori Mimura, Tokyo, JP;

Yoshiko Nakamura, Tokyo, JP;

Reijiro Shimura, Tokyo, JP;

Yu-ki Tashiro, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/08 (2006.01); C01G 27/00 (2006.01); C01G 27/02 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); H01L 21/02 (2006.01); H10N 30/077 (2023.01); C30B 29/22 (2006.01);
U.S. Cl.
CPC ...
C23C 14/083 (2013.01); C01G 27/006 (2013.01); C01G 27/02 (2013.01); C23C 14/34 (2013.01); C23C 14/5806 (2013.01); H10N 30/077 (2023.02); C30B 29/22 (2013.01); H01L 21/02197 (2013.01);
Abstract

Provided is a method for forming a ferroelectric film of a metal oxide having a fluorite-type structure at a low temperature of lower than 300° C., and a ferroelectric film obtained at a low temperature. The present invention provides a production method of a ferroelectric film comprising a crystalline metal oxide having a fluorite-type structure of an orthorhombic crystal phase, which comprises using a film sputtering method comprising sputtering a target at a substrate temperature of lower than 300° C., to deposit on the substrate a film of a metal oxide which is capable of having a fluorite-type structure of an orthorhombic crystal phase, and having a subsequent thermal history of said film of lower than 300° C.; or applying an electric field to said film after said deposition or after said thermal history of lower than 300° C. Also provided are the ferroelectric film, which is formed on an organic substrate, glass, or metal substrate, which can be used only at low temperatures, and a ferroelectric element and a ferroelectric functional element or device using the ferroelectric film.


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