The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Mar. 07, 2022
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventor:

Kai-Kuen Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/01 (2025.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/761 (2006.01); H10D 30/60 (2025.01); H10D 30/65 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H10D 30/0281 (2025.01); H01L 21/2253 (2013.01); H01L 21/26513 (2013.01); H01L 21/266 (2013.01); H01L 21/761 (2013.01); H10D 30/605 (2025.01); H10D 30/65 (2025.01); H10D 62/106 (2025.01); H10D 62/107 (2025.01); H10D 62/116 (2025.01); H10D 62/151 (2025.01); H10D 62/393 (2025.01); H10D 62/126 (2025.01);
Abstract

A fabricating method of a high voltage transistor includes providing a high voltage transistor. The high voltage transistor includes a substrate. A gate structure is disposed on the substrate. A source drift region and a drain drift region are respectively disposed at two sides of the gate structure and embedded within the substrate. A source is disposed in the source drift region. A drain is disposed within the drain drift region. The steps of fabricating the drain drift region include defining a drain drift region predetermined region on the substrate by using a photo mask. The photo mask includes a first comb-liked pattern. The first comb-liked pattern includes a first rectangle and numerous first tooth structures. Then, an ion implantation process is performed to implant dopants into the drain drift region predetermined region. Then, dopants in the drain drift region predetermined region are diffused to form the drain drift region.


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