The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Aug. 02, 2022
Ebara Corporation, Tokyo, JP;
Kazuhito Tsuji, Tokyo, JP;
Kentaro Yamamoto, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.