The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Dec. 23, 2021
Intel Corporation, Santa Clara, CA (US);
Hubert C. George, Highlands Ranch, CO (US);
Ravi Pillarisetty, Portland, OR (US);
Jongseok Park, Hillsboro, OR (US);
Stefano Pellerano, Beaverton, OR (US);
Lester F. Lampert, Portland, OR (US);
Thomas F. Watson, Portland, OR (US);
Florian Luethi, Portland, OR (US);
James S. Clarke, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.