The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Jun. 06, 2022
Applicants:

Changxin Memory Technologies, Inc., Hefei, CN;

Beijing Superstring Academy of Memory Technology, BeiJing, CN;

Inventors:

Xiaoguang Wang, Hefei, CN;

Huihui Li, Hefei, CN;

Xianqin Hu, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); H01L 27/22 (2006.01); H01L 43/12 (2006.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/80 (2023.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10B 61/00 (2023.02); H10N 50/01 (2023.02);
Abstract

A semiconductor structure includes: a Magnetic Random Access Memory (MRAM) cell, including a bottom electrode, a Magnetic Tunnel Junction (MTJ) stack and a top electrode; an insulating layer covering a sidewall partially and a top surface of the MRAM cell; a first dielectric layer, a stop layer and a second dielectric layer sequentially stacked on the insulating layer; and a top electrode contact hole penetrating through the second dielectric layer, the stop layer, the first dielectric layer and the insulating layer, and extending to the top electrode, where the top electrode contact hole includes a first portion and a second portion connected with each other in the stop layer, and a radial width of the second portion in contact with the top electrode is gradually decreased with an increase in a depth of the top electrode contact hole. Method for manufacturing the structure and semiconductor memory are also provided.


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