The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Sep. 29, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Smit Kapila, Bangalore, IN;

V M K Sarma Vedhanabhatla, Bangalore, IN;

Vikas Kundapura Rao, Udupi, IN;

David Rittenhouse, Fair Oaks, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); G06F 1/1681 (2013.01); G06F 1/203 (2013.01);
Abstract

A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.


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