The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Sep. 26, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Shigeru Sugioka, Hiroshima, JP;
Keizo Kawakita, Hiroshima, JP;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 23/5226 (2013.01); H01L 25/18 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0239 (2013.01);
Abstract
According to one or more embodiments of the disclosure, an apparatus comprising a metal layer and a redistribution layer on the metal layer is provided. The redistribution layer includes an insulating layer, a via, and a redistribution metal layer. The via is in the insulating layer and has a rectangular shape in a plan view. The redistribution metal layer has a first thickness on a shorter side of the rectangular shape of the via and a second thickness on a longer side of the rectangular shape of the via. The second thickness is greater than the first thickness.