The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2025

Filed:

Feb. 01, 2022
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventor:

Hao-Chuan Chang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/53266 (2013.01); H01L 23/53271 (2013.01); H01L 23/5329 (2013.01); H10B 12/482 (2023.02);
Abstract

A semiconductor structure and a method for forming the same are provided. A semiconductor structure includes a substrate, a bit line structure, a first conductive pillar, an interface layer, a second conductive pillar, and an intermediate structure. The substrate has an active area and an isolation structure. The bit line structure is disposed on the active area. The first conductive pillar is disposed on the active area. The interface layer is disposed on a top surface of the first conductive pillar. The second conductive pillar is disposed on the interface layer. The intermediate structure is disposed between the first conductive pillar and the bit line structure.


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