The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Apr. 30, 2021
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventors:
Ricardo Yandoc, Nijmegen, NL;
Florante Fenol, Nijmegen, NL;
Marlon Fadullo, Nijmegen, NL;
Ramil Atienza, Nijmegen, NL;
Assignee:
Nexperia B.V., Nijmegen, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49524 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/32 (2013.01); H01L 24/35 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/35831 (2013.01); H01L 2224/3701 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/41051 (2013.01); H01L 2224/84815 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device including a lead frame, a die attached to the lead frame using a first solder, and a clip attached to the die using a second solder is provided. The clip includes a notch arranged for a check of the excess of the second solder.