The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Feb. 27, 2020
Applicant:
Hitachi High-tech Corporation, Tokyo, JP;
Inventors:
Assignee:
Hitachi High-Tech Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G05B 19/418 (2006.01); H01J 37/20 (2006.01); H01J 37/244 (2006.01); H01J 37/26 (2006.01); H01J 37/28 (2006.01); H01J 37/305 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67276 (2013.01); G05B 19/41875 (2013.01); H01J 37/20 (2013.01); H01J 37/244 (2013.01); H01J 37/265 (2013.01); H01J 37/28 (2013.01); H01J 37/305 (2013.01); G05B 2219/32368 (2013.01); H01J 2237/0473 (2013.01); H01J 2237/221 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/2802 (2013.01); H01J 2237/31749 (2013.01);
Abstract
A semiconductor analysis system includes a machining device that machines semiconductor wafer to prepare a thin film sample for observation, a transmission electron microscope device that acquires a transmission electron microscope image of the thin film sample, and a host control device that controls the machining device and the transmission electron microscope device. The host control device evaluates the thin film sample based on the transmission electron microscope image, updates machining conditions based on an evaluation result of the thin film sample, and outputs the updated machining conditions to the machining device.