The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
Mar. 01, 2022
Anaglobe Technology, Inc., Hsinchu, TW;
Yang Hsu, Tainan, TW;
Min-Hsuan Chung, Yunlin County, TW;
Yao-Wen Chang, Taipei, TW;
Yu-Tsang Hsieh, Hsinchu County, TW;
ANAGLOBE TECHNOLOGY, INC., Hsinchu, TW;
Abstract
A method of warpage-aware floorplanning for heterogeneous integration structure is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a performing a layout partitioning to divide a layout into a plurality of grids; performing an initial floorplanning by assigning first geometric relations between a plurality of dies such that an effective material of each grid of the plurality of grids is determined; performing a global floorplanning to change the first geometric relations between the plurality of dies to second geometric relations to optimize warpage effect of the heterogeneous integration structure; and performing a detailed floorplanning to determine die order of placement based on material differences between the plurality of dies and an interposer.