logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12344758 B1

PDFFull Text
Date of Patent:
Jul. 01, 2025

Filed:

Mar. 03, 2020

Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof

Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Takafumi Endo, Toyama, JP;

Tokio Nishita, Toyama, JP;

Assignee:

NISSAN CHEMICAL CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C09D 163/00 (2006.01); C08G 59/14 (2006.01); C08G 59/24 (2006.01); C08G 59/26 (2006.01); C08G 59/42 (2006.01); C08G 59/66 (2006.01); C09D 5/00 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); G03F 7/26 (2006.01); H01L 21/027 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08G 59/245 (2013.01); C08G 59/26 (2013.01); C08G 59/4207 (2013.01); C08G 59/423 (2013.01); C08G 59/4284 (2013.01); C08G 59/66 (2013.01); C09D 5/002 (2013.01); G03F 7/11 (2013.01); H01L 21/30604 (2013.01); H01L 21/3081 (2013.01); H01L 21/31111 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

Find Patent Forward Citations

Loading…