The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

May. 16, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kun-Yu Lee, Tainan, TW;

Chunyao Wang, Zhubei, TW;

Chi On Chui, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H10D 30/01 (2025.01); H10D 84/01 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H01L 21/02356 (2013.01); H01L 21/76224 (2013.01); H10D 84/0151 (2025.01); H10D 84/834 (2025.01); H01L 21/0214 (2013.01); H01L 21/02148 (2013.01); H01L 21/02164 (2013.01); H01L 21/0217 (2013.01); H01L 21/02181 (2013.01); H01L 21/02183 (2013.01); H01L 21/02189 (2013.01); H01L 21/02192 (2013.01); H01L 21/02194 (2013.01); H01L 21/022 (2013.01); H01L 21/02271 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and a second fin structure over a semiconductor substrate and a first epitaxial structure over the first fin structure. The semiconductor device structure also includes a second epitaxial structure over the second fin structure. The semiconductor device structure further includes a dielectric fin over the semiconductor substrate. The dielectric fin is between the first fin structure and the second fin structure. The dielectric fin has an inner portion and a protective layer. The protective layer extends along sidewalls and a bottom of the inner portion, and the protective layer has a dielectric constant higher than that of the inner portion.


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