The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Dec. 08, 2023
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Antonino Rigano, Cernusco sul Naviglio, IT;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G11C 11/22 (2006.01); H10B 12/00 (2023.01); H10B 53/30 (2023.01); H10B 53/40 (2023.01); H10D 30/63 (2025.01);
U.S. Cl.
CPC ...
H10B 12/34 (2023.02); G11C 11/221 (2013.01); H10B 12/0383 (2023.02); H10B 53/30 (2023.02); H10B 53/40 (2023.02); H10D 30/63 (2025.01);
Abstract

A method used in forming an array of memory cells comprises forming a vertical stack comprising transistor material directly above and directly against a first capacitor electrode material. A mask is used to subtractively etch both the transistor material and thereafter the first capacitor electrode material to form a plurality of pillars that individually comprise the transistor material and the first capacitor electrode material. Capacitors are formed that individually comprise the first capacitor electrode material of individual of the pillars. Vertical transistors are formed above the capacitors that individually comprise the transistor material of the individual pillars. Other aspects and embodiments are disclosed, including structure independent of method.


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