The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
May. 09, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyunmog Park, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes: a semiconductor structure including: a first bonding semiconductor chip; a second bonding semiconductor chip on the first bonding semiconductor chip, the second bonding semiconductor chip having a cross-section area in a horizontal direction less than a cross-section area of the first bonding semiconductor chip in the horizontal direction; a chip connection pad between the first bonding semiconductor chip and the second bonding semiconductor chip; and a wire bonding pad on the first bonding semiconductor chip to be outside of the second bonding semiconductor chip; a first stacked semiconductor chip on the semiconductor structure and including a first chip pad on an upper surface thereof; and a second stacked semiconductor chip on the first stacked semiconductor chip to expose the first chip pad and including a second chip pad on an upper surface thereof.