The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Nov. 09, 2022
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Kenichi Koi, Nagano, JP;

Hitoshi Ito, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5387 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 23/495 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05584 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/8392 (2013.01); H01L 2224/83986 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/0715 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor element including a first face and a second face; a second semiconductor element including a third face and a fourth face; an insulating base member including a fifth face and a sixth face; a first wiring that penetrates through the insulating base member, and is disposed on the sixth face; a second wiring that penetrates through the insulating base member, and is disposed on the sixth face; a first wiring member that faces the second face; and a second wiring member that faces the sixth face, and is electrically connected to the second wiring. The second wiring member is bonded to the first and second wirings while the insulating base member is folded. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the second wiring member.


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