The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Aug. 11, 2022
Disco Corporation, Tokyo, JP;
Hideyuki Sandoh, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
An outer circumferential region of a metal film and a portion of an outer circumferential region of a substrate on a reverse side thereof are removed, thereby exposing the outer circumferential region of the substrate and creating on a reverse side of an outer circumferential region of the wafer an exposed surface where a portion closer to a face side of a wafer is located outwardly of a portion remoter from the face side of the wafer. When a tape is affixed to a reverse side of the wafer, no gap or a reduced gap is formed between the tape and the outer circumferential region of the wafer. As a result, problems are restrained from occurring when the wafer is divided to manufacture chips therefrom.