The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Dec. 08, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ashim Dutta, Clifton Park, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76885 (2013.01); H01L 21/76837 (2013.01); H01L 23/5226 (2013.01); H01L 23/53257 (2013.01);
Abstract

A first metal layer is deposited on a substrate. The first metal layer is etched to form one or more metal lines and expose portions of the substrate. A second metal layer is deposited on the exposed portions of the substrate between the one or more metal lines. The first metal layer is patterned to form one or more vertical vias. A dielectric layer is deposited on the exposed portions of the substrate between an exposed sidewalls of the first metal layer and an exposed sidewalls of the second metal layer.


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