The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Jun. 12, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jung-Chan Yang, Hsinchu, TW;

Hui-Zhong Zhuang, Hsinchu, TW;

Ting-Wei Chiang, Hsinchu, TW;

Chi-Yu Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G03F 1/36 (2012.01); G03F 1/70 (2012.01); G06F 30/30 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 30/3953 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G03F 1/36 (2013.01); G03F 1/70 (2013.01); G06F 30/30 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 30/3953 (2020.01); G06F 2119/18 (2020.01);
Abstract

A semiconductor device includes a plurality of active regions extending in a first direction. The semiconductor device further includes a gate electrode over the plurality of active regions, wherein the gate electrode extends in a second direction perpendicular to the first direction. The semiconductor device further includes a power rail extending in the first direction. The power rail includes a first power rail portion adjacent to the first boundary, wherein the first power rail portion has a first inner edge, and a second power rail portion adjacent to the second boundary, wherein the second power rail portion has a second inner edge, and the first inner edge is offset from the second inner edge in the second direction.


Find Patent Forward Citations

Loading…