The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Mar. 15, 2022
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Chia-Wei Chen, Chiayi, TW;

Ching-Pei Lin, Hsinchu County, TW;

Chung-Yi Chiu, Tainan, TW;

Te-Hsuan Chen, Tainan, TW;

Ming-Wei Chen, Tainan, TW;

Hsiao-Ying Yang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 13/04 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G05B 13/048 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01);
Abstract

A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.


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