The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Sep. 08, 2022
Applicant:

Wuhan Dr Laser Technology Corp., Ltd., Wuhan, CN;

Inventors:

Amir Noy, Kfar Mordechai, IL;

Gad Igra, Ness Ziona, IL;

Oren Stern, Netiv HaAsara, IL;

Eran Yunger, Moshav Sdei Avraham, IL;

Moshe Finarov, Reshovot, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/025 (2006.01); B41J 2/44 (2006.01); C23C 14/04 (2006.01); H10F 71/00 (2025.01); B41J 29/393 (2006.01); B41M 5/24 (2006.01); C23C 14/28 (2006.01); H05K 1/09 (2006.01); H05K 3/20 (2006.01); H10F 77/20 (2025.01);
U.S. Cl.
CPC ...
B41M 5/0256 (2013.01); B41J 2/442 (2013.01); C23C 14/048 (2013.01); H10F 71/00 (2025.01); B41J 29/393 (2013.01); B41M 5/24 (2013.01); C23C 14/28 (2013.01); H05K 1/092 (2013.01); H05K 3/207 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0113 (2013.01); H10F 77/211 (2025.01);
Abstract

Dynamic pattern transfer printing systems and method are provided, which decouple the design of the trench patterns on a source substrate for pattern transfer printing, from the resulting metallic paste lines patterns transferred to a receiving substrate, such as PV cells. The receiving substrate may be moved forward (along the scanning direction of the laser illumination used to transfer the paste from the trenches onto the receiving substrate) to reduce the pattern pitch with respect to the source substrate, and/or the receiving substrate may be moved backward (against the scanning direction) to increase the pattern pitch with respect to the source substrate. For example, dynamic pattern transfer printing may be used to accommodate different widths of the substrates for more effective pattern transfer, and/or to enable one-to-many pattern transfer technologies with high wafer throughput. Also, pattern transfer sheet with separate multiple groups of trenches are provided.


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