The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Jun. 26, 2023
Kyushu University, National University Corporation, Fukuoka, JP;
Ngk Insulators, Ltd., Nagoya, JP;
Osamu Takakuwa, Fukuoka, JP;
Hisao Matsunaga, Fukuoka, JP;
Takahiro Ishikawa, Toyoake, JP;
Hiromitsu Uchiyama, Agui, JP;
Masato Sakakibara, Handa, JP;
Masaaki Akaiwa, Handa, JP;
Kyushu University, National University Corporation, Fukuoka, JP;
NGK INSULATORS, LTD., Nagoya, JP;
Abstract
A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solution annealing and an aging treatment, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.