The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Dec. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Minseok Yoo, Suwon-si, KR;

Minsu Seol, Seoul, KR;

Junyoung Kwon, Seoul, KR;

Kyung-Eun Byun, Seongnam-si, KR;

Hyeonjin Shin, Suwon-si, KR;

Van Luan Nguyen, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/27 (2025.01); H01L 21/02 (2006.01); H10D 30/47 (2025.01); H10D 30/67 (2025.01); H10D 62/80 (2025.01); H10D 64/60 (2025.01);
U.S. Cl.
CPC ...
H10D 64/513 (2025.01); H10D 30/6735 (2025.01); H10D 64/60 (2025.01);
Abstract

Disclosed are an electronic device including a two-dimensional material, and a method of fabricating the electronic device. The electronic device may include a first metal layer including a transition metal, a second metal layer on the first metal layer and including gold (Au), and a two-dimensional material layer between the first metal layer and the second metal layer. The two-dimensional material layer may include a transition metal dichalcogenide (TMD). The two-dimensional material layer may be formed as a chalcogen element diffuses into the second metal layer and reacts with the transition metal of the first metal layer adjacent to the second metal layer.


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