The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jan. 05, 2022
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Chang-Lin Yeh, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/3736 (2013.01);
Abstract

An electronic package is provided in the present disclosure. The electronic package comprises: an electronic component; a thermal conductive element above the electronic component, wherein thermal conductive element includes a first metal; an adhesive layer between the electronic component and the thermal conductive element, wherein the first adhesive layer includes a second metal; and an intermetallic compound (IMC) between the first metal and the second metal.


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Yeh, Chang-Lin. (2025). Electronic package and method of forming the same (U.S. Patent No. 12334412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12334412

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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