The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Jun. 17, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Hsiang-Wei Lin, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10D 30/62 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/76802 (2013.01); H01L 21/76832 (2013.01); H01L 21/76846 (2013.01); H01L 23/5226 (2013.01); H10D 30/6211 (2025.01);
Abstract

A semiconductor structure includes a gate structure over a substrate. The structure also includes a source/drain epitaxial structure formed on opposite sides of the gate structure. The structure also includes a contact structure formed over the gate structure. The structure also includes a metal layer formed over the contact structure. The structure also includes a cap layer formed over the metal layer. The structure also includes a first etch stop layer including a metal compound formed over the cap layer. The structure also includes a second etch stop layer including nitrogen formed over the first etch stop layer. The structure also includes a via structure that passes through the first etch stop layer and the second etch stop layer. The bottom surface of the cap layer is level with the bottom surface of the first etch stop layer.


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