The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Mar. 26, 2024
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Shigetaka Otagiri, Toyama, JP;

Tokio Nishita, Toyama, JP;

Takafumi Endo, Toyama, JP;

Yuki Endo, Toyama, JP;

Takahiro Kishioka, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/14 (2006.01); C08G 59/16 (2006.01); C08G 59/26 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C09D 163/00 (2006.01); C09D 163/10 (2006.01); G03F 7/11 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C08G 59/1483 (2013.01); C08G 59/1455 (2013.01); C08G 59/26 (2013.01); C08G 59/621 (2013.01); C08G 59/68 (2013.01); H01L 21/027 (2013.01); H01L 21/67075 (2013.01);
Abstract

A protective film-forming composition including good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of semiconductor substrates, including good coverage even in stepped substrates, and from which flat films can be formed due to a small difference in film thickness after embedding; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. A protective film-forming composition which protects against a semiconductor wet etching liquid, wherein a reaction product (P) of a diepoxy compound (B) and an bifunctional proton-generating compound (C) contains a structure represented by formula (1) (in formula (1), Ar represents a C6-40 aryl group, n represents an integer of 2-10, —Y— represents —OCO—, —O— or —S—, and * represents the bonding site with the reaction product (P) molecule terminal). The protective film-forming composition further includes an organic solvent (S).


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