The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Jun. 22, 2021
Applicant:

Horiba Stec, Co., Ltd., Kyoto, JP;

Inventors:

Lei Ma, Kyoto, JP;

Andrew Price, Kyoto, JP;

Tadahiro Yasuda, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32449 (2013.01); H01L 21/683 (2013.01);
Abstract

An electrostatic chuck device for adsorbing an object by electrostatic force comprises an adsorption plate that has an adsorption surface to adsorb the object, a gas supplying line that supplies a thermally conductive gas to a gap between the adsorption surface and an adsorbed surface of the object and a pressure calculation section that calculates the pressure of the thermally conductive gas in the gap. The gas supplying line is provided with a flow rate resistive element that serves as a resistance when the thermally conductive gas flows. The pressure calculation section calculates the pressure of the thermally conductive gas in the gap based on the primary side pressure of the flow rate resistive element, the flow rate of the thermally conductive gas passing through the flow rate resistive element and the flow characteristic of the flow rate resistive element.


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