The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2025

Filed:

Jul. 27, 2021
Applicant:

Betone Technology Shanghai, Inc., Shanghai, CN;

Inventors:

Xiaoliang Jin, San Jose, CA (US);

Waleyweitsung Sung, San Jose, CA (US);

Zhongyun Li, Shanghai, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/505 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4584 (2013.01); C23C 16/4586 (2013.01); C23C 16/505 (2013.01);
Abstract

A reciprocating rotary CVD apparatus and a method for applying same. The reciprocating rotary CVD apparatus includes a cavity, a wafer heating base, a rotating apparatus. The rotating apparatus is located outside the cavity and includes a rotating power mechanism and a rotating sealing mechanism, and the rotating sealing mechanism includes a rotating member and a fixed member; the fixed member is fixedly and hermetically connected to the cavity, the rotating member is fixedly and hermetically connected to the wafer heating base, the rotating member is movably and hermetically connected to the fixed member, and the rotating member is connected to the rotating power mechanism, to drive, by using the rotating power mechanism, the rotating member and the wafer heating base to perform reciprocating rotation. In the present invention, the rotating apparatus rotates, to improve the uniformity of thin film deposition in a circumferential direction of a wafer.


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