The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Nov. 15, 2021
Tohoku University, Sendai, JP;
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Akihito Fujino, Isehara, JP;
Kunihiro Tanaka, Isehara, JP;
Shuichi Kubota, Isehara, JP;
Takao Asada, Isehara, JP;
Tetsuo Endoh, Sendai, JP;
Shoji Ikeda, Sendai, JP;
TOHOKU UNIVERSITY, Sendai, JP;
TANAKA KIKIZOKU KOGYO K.K., Tokyo, JP;
Abstract
The present invention relates to a platinum-based sputtering target containing platinum or a platinum alloy. The platinum-based sputtering target of the present invention is characterized by a material structure in a thickness-direction cross section thereof. Specifically, when a thickness-direction cross section is equally divided into n sections (n=5 to 20) along a thickness direction, a region including (n−2) sections excluding both end sections is set as a determination region, and when an average grain size in each of the sections is measured in the determination region, as well as an average grain size in the entire determination region is measured, the average grain size in the entire determination region is 150 μm or less, and a coefficient of variation calculated based on the average grain size in each of the sections of the determination region is 15% or less.