The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

Oct. 19, 2022
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventor:

Yu-Shen Chen, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01H 37/04 (2006.01); H01H 37/52 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/16 (2013.01); H01H 37/04 (2013.01); H01H 37/52 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H05K 1/0206 (2013.01); H05K 1/183 (2013.01); H05K 1/186 (2013.01); H05K 3/30 (2013.01); H01H 2037/525 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/211 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H05K 2201/10053 (2013.01);
Abstract

This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip. A thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.


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