The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Mar. 30, 2021
Applicant:
Tdk Electronics Ag, Munich, DE;
Inventors:
Yongli Wang, Frauental, AT;
Qirong Li, Zhongshan, CN;
Masahiro Oishi, Deutschlandsberg, AT;
Axel Pecina, St. Martin, AT;
Assignee:
TDK Electronics AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/24 (2021.01); H01M 10/0562 (2010.01); H01M 50/227 (2021.01); H01M 50/247 (2021.01); H01M 50/298 (2021.01); H01M 50/50 (2021.01); H01M 50/516 (2021.01); H01M 50/536 (2021.01);
U.S. Cl.
CPC ...
H01M 50/24 (2021.01); H01M 10/0562 (2013.01); H01M 50/227 (2021.01); H01M 50/247 (2021.01); H01M 50/50 (2021.01); H01M 50/536 (2021.01); H01M 50/298 (2021.01); H01M 50/516 (2021.01);
Abstract
In an embodiment an assembly includes at least one surface mounted device (SMD) component, a metallic wiring configured to lead current from the at least one SMD component to an external circuit and at least one protection element is configured to cover all outer surface of the at least one SMD component and at least parts of the metallic wiring, wherein the assembly has a structure of a molded module, and wherein the at least one SMD component includes a rechargeable all solid-state battery.