The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Jun. 16, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Ying-Chung Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H04R 1/10 (2006.01); H04R 29/00 (2006.01); G01C 3/08 (2006.01); G01J 5/12 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H04R 1/1016 (2013.01); H04R 1/1041 (2013.01); H04R 1/1075 (2013.01); H04R 29/001 (2013.01); G01C 3/08 (2013.01); G01J 5/12 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H04R 1/023 (2013.01);
Abstract
A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.