The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2025

Filed:

May. 09, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Heng Wu, Santa Clara, CA (US);

Ruilong Xie, Niskayuna, NY (US);

Albert M. Chu, Nashua, NH (US);

Albert M. Young, Fishkill, NY (US);

Junli Wang, Slingerlands, NY (US);

Brent A. Anderson, Jericho, VT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/76897 (2013.01); H01L 23/481 (2013.01); H10D 64/258 (2025.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32145 (2013.01); H10D 64/01 (2025.01);
Abstract

Embodiments of present invention provide a transistor structure. The transistor structure includes a first and a second transistor in a first transistor layer; a first and a second transistor in a second transistor layer, respectively, above the first and the second transistor in the first transistor layer; a metal routing layer between the first transistor layer and the second transistor layer; a first local interconnect connecting the first transistor of the first transistor layer to the metal routing layer; and a second local interconnect connecting the metal routing layer to the second transistor of the second transistor layer. A method of manufacturing the transistor structure is also provided.


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