The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Nov. 10, 2022
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd., Hubei, CN;
Kaiwei Cao, Hubei, CN;
Peng Sun, Hubei, CN;
Jun Zhou, Hubei, CN;
Qiong Zhan, Hubei, CN;
Wei Huang, Hubei, CN;
Chunyuan Hou, Hubei, CN;
Abstract
Semiconductor structure, comprising a memory-array unit comprising: a substrate, a memory array disposed on the substrate, and a first bonding region disposed around the memory array. The memory array comprises multiple word lines, multiple bit lines, and multiple source lines. The first bonding region comprises a first substrate-connecting bonding region, a first bit-line bonding region, a first word-line bonding region, and a first source-line bonding region. The first substrate-connecting bonding region is configured to connect the substrate electrically to a surface of the memory-array unit, the first bit-line bonding region is configured to connect the bit lines electrically to the surface of the memory-array unit, the first word-line bonding region is configured to connect the word lines electrically to the surface of the memory-array unit, and the first source-line bonding region is configured to connect the source lines electrically to the surface of the memory-array unit.