Integrated silicon photonics transceivers enabling ultra-high-speed high dense input/output and interconnect for terabyte per second optical interconnect

Abstract

In one embodiment, an optical transceiver includes: a photonic integrated circuit (PIC) formed on a semiconductor die having a first side and a second side opposite the first side, where the first side includes a first optical circuit and a second optical circuit and the second side is to electrically couple with a substrate. The PIC may further have one or more through silicon vias (TSVs) formed through the semiconductor die to electrically couple the first side with the second side, where at least one of the TSVs is to enable electrical coupling between a first other die adapted to the first side and a second other die. Other embodiments are described and claimed.