The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Mar. 18, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); H01L 25/16 (2023.01); H10F 71/00 (2025.01); H10F 77/40 (2025.01); H10F 77/50 (2025.01); H10H 20/852 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/852 (2025.01); G02B 6/12004 (2013.01); G02B 6/4206 (2013.01); H01L 25/167 (2013.01); H10F 71/00 (2025.01); H10F 77/407 (2025.01); H10F 77/50 (2025.01); H10H 20/855 (2025.01); H10H 20/857 (2025.01); H10H 20/0362 (2025.01); H10H 20/0363 (2025.01);
Abstract
A manufacturing method of a semiconductor package includes the following steps. A photonic die is provided, wherein the photonic die includes an optical coupler. An electronic die is bonded over the photonic die. An encapsulating material is provided over the photonic die, wherein the encapsulating material at least laterally encapsulates the electronic die. A substrate is bonded over the encapsulated electronic die. A lens structure is formed over the photonic die, wherein the lens structure is overlapped with the optical coupler from a top view.