The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Apr. 11, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Zhiwen Chen, Tokyo, JP;

Youngsuk Kim, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/85 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/831 (2025.01); H10H 29/14 (2025.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H10H 20/8506 (2025.01); H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/8312 (2025.01); H10H 29/142 (2025.01); H01L 25/167 (2013.01); H10H 20/032 (2025.01); H10H 20/0364 (2025.01);
Abstract

A method of manufacturing an LED display panel includes holding an LED wafer on a first holding unit, holding a circuit board on a second holding unit, positioning electrodes of the board at positions corresponding to electrode layers of the wafer while a face side of the board and a face side of the wafer are facing each other, joining the electrode layers and the electrodes to each other by applying a laser beam having a wavelength absorbable by a reverse side of one of the board and the wafer, to the reverse side of the one of the board and the wafer, thereby heating at least either the electrode layers or the electrodes, and breaking the buffer layers by applying a pulsed laser beam having a wavelength transmittable through a substrate of the wafer, to the buffer layers through a reverse side of the wafer.


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