The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Apr. 20, 2022
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventor:
Yu-Te Hsieh, Taoyuan, TW;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/80 (2025.01); H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H10F 39/011 (2025.01); H10F 39/18 (2025.01); H10F 39/804 (2025.01); H10F 39/8063 (2025.01);
Abstract
A method includes disposing a first die on a first die-receiving surface in a first cavity at a first vertical height in a substrate and disposing a second die on a second die-receiving surface in a second cavity at a second vertical height in the substrate. The second cavity has an open top, and the second vertical height is greater than the first vertical height in the substrate.