The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

May. 07, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chung-Chieh Lee, Taipei, TW;

Chi-Ming Yang, Hsinchu, TW;

Chyi Shyuan Chern, Taipei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H01L 21/66 (2006.01); H10D 30/01 (2025.01); H10D 84/01 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H01L 22/10 (2013.01); H10D 30/024 (2025.01); H10D 84/0158 (2025.01);
Abstract

The present disclosure provides a method for forming a semiconductor structure, including dispensing a dehydrating chemical over a fin of a substrate, wherein the dehydrating chemical includes a first chemical, and a second chemical having a melting point greater than the melting point of the first chemical, and solidifying the dehydrating chemical.


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Lee, Chung-Chieh. (2025). Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure (U.S. Patent No. 12317576). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12317576

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