The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
May. 03, 2023
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Santanu Sarkar, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H10D 48/01 (2025.01); H10D 62/80 (2025.01); H10D 62/83 (2025.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H01L 23/53276 (2013.01); H01L 23/53261 (2013.01); H01L 23/5329 (2013.01); H10D 48/01 (2025.01); H10D 62/8303 (2025.01); H10D 62/882 (2025.01); H10D 86/425 (2025.01); H01L 21/76807 (2013.01); H01L 21/76843 (2013.01);
Abstract
Some embodiments include an integrated assembly having a first graphene-containing-material offset from a second graphene-containing-material. The first graphene-containing-material includes a first graphene-layer-stack with first metal interspersed therein. The second graphene-containing-material includes a second graphene-layer-stack with second metal interspersed therein. A conductive interconnect couples the first and second graphene-containing materials to one another.