The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Mar. 05, 2020
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76817 (2013.01); H01L 21/76877 (2013.01);
Abstract
Disclosed is a method for manufacturing an electronic component including: forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material; curing the sealing resin layer; filling the via hole with a conductor precursor; and forming a conductive via by heating the conductor precursor filled in the via hole.