The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Jun. 01, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Li-Han Lin, Taoyuan, TW;

Jr-Chiuan Wang, New Taipei, TW;

Szu-Yu Hou, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/76825 (2013.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 21/76816 (2013.01); H10B 12/482 (2023.02); H10B 12/485 (2023.02);
Abstract

A method for manufacturing a semiconductor structure is provided. First, a first insulating layer is formed over a substrate, and a second insulating layer having an opening is formed over the first insulating layer. A conductive line structure is formed in the opening of the second insulating layer, thereby forming a contact void between the second insulating layer and the conductive line structure. A plasma oxide layer is conformally formed over the conductive line structure, the first insulating layer, and the contact void. A nitride capping layer is formed over the plasma oxide layer to fill the contact void. Then, nitrogen ions are introduced into a surface of the nitride capping layer surrounding the conductive line structure. An etching back process is performed to remove a portion of the nitride capping layer, thereby forming a refilled contact void between the first insulating layer and the conductive line structure.


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