The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

Mar. 18, 2019
Applicant:

Jx Advanced Metals Corporation, Tokyo, JP;

Inventors:

Katsushi Aoki, Hitachi, JP;

Tsubasa Takeda, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B03C 1/02 (2006.01); B09B 5/00 (2006.01); C22B 1/00 (2006.01); C22B 7/00 (2006.01); B07B 4/08 (2006.01); B07C 5/342 (2006.01); B07C 5/344 (2006.01); B07C 5/36 (2006.01);
U.S. Cl.
CPC ...
C22B 7/005 (2013.01); B03C 1/02 (2013.01); B09B 5/00 (2013.01); C22B 1/005 (2013.01); B03C 2201/20 (2013.01); B07B 4/08 (2013.01); B07C 5/3422 (2013.01); B07C 5/344 (2013.01); B07C 5/363 (2013.01);
Abstract

Provided is a method for processing electronic and electrical device component scrap, which can increase an amount of electronic and electrical device component scrap processed in a smelting step and efficiently recover valuable metals. The method for processing electronic and electrical device component scrap includes: a stepof removing powdery materials and film-shaped component scrap from the electronic and electrical device component scrap; a stepof concentrating synthetic resins and substrates from the electronic and electrical device component scrap from which the powdery materials and film-shaped component scrap have been removed; and a stepof concentrating the substrates containing valuable metals from a concentrate obtained in the step


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