The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

May. 06, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Cheng-Chieh Huang, Kaohsiung, TW;

Chen-Chieh Chiang, Kaohsiung, TW;

Wen-Sheng Lin, Tainan, TW;

Hsun-Jui Chang, Tainan, TW;

Yen-Han Chen, Pingtung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 84/03 (2025.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 64/01 (2025.01); H10D 84/01 (2025.01); H10D 84/85 (2025.01); H10D 30/67 (2025.01);
U.S. Cl.
CPC ...
H10D 84/038 (2025.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 64/01 (2025.01); H10D 64/021 (2025.01); H10D 84/017 (2025.01); H10D 84/0184 (2025.01); H10D 84/0186 (2025.01); H10D 84/0193 (2025.01); H10D 84/853 (2025.01); H10D 30/6219 (2025.01); H10D 30/673 (2025.01);
Abstract

A semiconductor device with different gate structures and a method of fabricating the same are disclosed. The a method includes forming a fin structure on a substrate, forming a thermal oxide layer on top and side surfaces of the fin structure, forming a polysilicon structure on the thermal oxide layer, doping portions of the fin structure uncovered by the polysilicon structure to form doped fin portions, forming a nitride layer on the polysilicon structure and the thermal oxide layer, forming an oxide layer on the nitride layer, doping the nitride layer with halogen ions, forming a source/drain region in the fin structure and adjacent to the polysilicon structure, and replacing the polysilicon structure with a gate structure.


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