The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Nov. 09, 2022
Disco Corporation, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A tape pressure bonding apparatus includes an upper chamber, a lower chamber, a lifting mechanism that switches between a closed state in which the upper chamber is moved downward to be brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber, and an atmosphere opening section that opens the upper chamber and the lower chamber to the atmosphere. The lower chamber accommodates a wafer table that has a holding surface including a circular recess for supporting only a peripheral surplus region of the wafer and making a device region in a non-contact state. The tape pressure bonding apparatus includes a positive pressure generating section that supplies air into the circular recess of the wafer table to establish a positive pressure state in the circular recess.