The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

Sep. 30, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tung-Huang Chen, Hsinchu, TW;

Chi-Hao Kung, Hsinchu, TW;

Yen-Yu Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67323 (2013.01); H01L 21/324 (2013.01); H01L 21/67098 (2013.01); H01L 21/67309 (2013.01); H01L 21/6875 (2013.01);
Abstract

A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers have a plurality of different shapes and a substrate surface no contact region.


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