The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Nov. 16, 2021
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Takashi Uchiho, Tokyo, JP;
Yoshinori Kakinuma, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/402 (2014.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B23K 26/402 (2013.01); H01L 21/6838 (2013.01); H01L 21/68707 (2013.01); H01L 21/68735 (2013.01);
Abstract
A processing apparatus includes a tape pressure bonding unit that executes pressure bonding of a tape of a tape-attached frame to a back surface of a wafer. The tape pressure bonding unit includes an upper chamber, a lower chamber, a raising-lowering mechanism that raises and lowers the upper chamber, a vacuum part that sets the upper chamber and the lower chamber to a vacuum state, and an opening-to-atmosphere part that opens the upper chamber and the lower chamber to the atmosphere.