The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Aug. 28, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Christopher Michael Moore, Hillsboro, OR (US);
Curtis Koepsell, Beaverton, OR (US);
Juha Tapani Paavola, Hillsboro, OR (US);
Monica Maria Conejo Herrera, Alajuela, CR;
Luis Diego Jimenez Sanchez, San Pedro, CR;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 23/10 (2006.01); B21C 23/08 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
B21C 23/085 (2013.01); H05K 7/20254 (2013.01); H05K 7/20336 (2013.01); H05K 7/20509 (2013.01);
Abstract
Metal is extruded through a feeder plate and an extrusion die to form a heat pipe component that includes a length of pipe and a flange extending outward from the pipe along the length of the pipe. A section of the flange is removed from the extruded heat pipe component, the pipe is sealed and compressed to reduce its thickness and form a heat pipe element for a computing system.